瓷修复体与金属托槽粘接强度的实验研究(1)
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[摘要]目的：研究两种不同形状的底板(燕尾状、网状)对正畸金属托槽与瓷修复体粘接强度的影响。方法：根据瓷面处理方式及所粘接托槽的不同，将80个瓷修复体随机平均分为4组：金刚砂车针打磨+燕尾状底板托槽；金刚砂车针打磨+网状底板托槽；9.6%氢氟酸(hydrofluoric acid,HF)酸蚀+燕尾状底板托槽；9.6% HF酸蚀+网状底板托槽。将粘接后的每组瓷修复体随机平均分为2组：组1用37℃人工唾液水浴24h；组2不予处理。用硅烷偶联剂、杜拉菲勒光固化复合树脂充填材料进行粘接。检测抗剪切强度及粘结剂残留指数。结果：经人工唾液水浴后，抗剪切强度燕尾状底板托槽组较网状底板托槽组高，且差别有统计学意义(P<0.05)；瓷面经打磨处理后，粘结剂残留指数网状底板组高于燕尾状底板组，且差别有统计学意义(P<0.05)。结论：燕尾状底板较网状底板提供更大的抗剪切强度；瓷面经金刚砂车针打磨较用HF酸蚀提供更大的抗剪切强度，且遗留较多粘接剂。
[关键词]瓷修复体；托槽底板；抗剪切强度；粘结剂残留指数
[中图分类号]R783.1 [文献标识码]A [文章编号]1008-6455(2012)02-0257-04
Investigation into the bond strength of metal brackets to ceramic restoration
WANG Chun-ye,SHAO Ping,ZHAO Yuan,XU Shi-qian,SONG Bing
(Department of Orthodontics,College of Stomatology,Harbin Medical University,Harbin 150001,Heilongjiang,China)
Abstract: Objective To investigate the influence of different bracket base surfaces ( swallow-tail-backed and mesh-backed ) on the bond strength of metal brackets to porcelain. Methods Methods 80 ceramics specimen were randomly and equally divided into 4 groups according to different conditioning techniques: (A)deglazing by grinding and bonding swallow-tail-backed metal brackets, (B)deglazing by grinding and bonding mesh-backed metal brackets,(C) etching with 9.6% hydrofluoric acid(HF) and bonding swallow-tail-backed metal brackets, (D) etching with 9.6% HF and bonding mesh-backed metal brackets. Each group was further divided into 2 groups randomly and equally: (1) all specimens were stored in artificial saliva at 37℃ for 24 hours, (2) untreated. Silane coupling agents and Durafill BondTM adhesive were utilized to bond the bracket onto each sample. The shear bond strength and the Adhesive remnant index(ARI) were determined. Results After artificial saliva bath,the swallow-tail-backed groups resulted in a statistically significant higher bond strength. Deglazing specimens,mesh-backed group in which has a statistically significant higher adhesive remnant index (ARI). Conclusion The swallow-tail-backed groups resulted in a higher bond strength(SBS). The deglazing group had a higher SBS than the group of etching with 9 ......
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